Aerospace and Mechanical Insider on MSN

Six transformative shifts in engineering simulation

By 2024, engineering simulation has evolved into a cornerstone of industrial innovation, underpinning efforts to address ...
Semiconductor Engineering

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
National Academies of Sciences%2c Engineering%2c and Medicine

Statistics, Testing, and Defense Acquisition: New Approaches and Methodological Improvements

As part of system development, many industries, including the automobile industry, make substantial use of modeling and simulation to help understand system performance. Modeling and simulation ...
Semiconductor Engineering

Using Process Modeling To Enhance Device Uniformity During Self-Aligned Quadruple Patterning

We first developed a virtual device structure to test how ALD thickness affects hole size uniformity and CD. We started our virtual experiment by using two crisscross SAQP processes and transferring a ...