The last year has been great for Nvidia hardware. Nvidia released a graphics card using the Pascal architecture, 1080s are heating up server rooms the world over, and now Nvidia is making yet another ...
A new digital interface upgrade brings intelligent monitoring, programmable control and simplified integration to ...
TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...
For extra-powerful, high-efficiency inverter systems in railcars, electric power systems and more Mitsubishi Electric’s SBD-embedded SiC-MOSFET modules, including the 3.3kV/800A version released on ...
Thirty years after the mainstream adoption of the personal computer, the industry faces another paradigm shift in information technology. The innovations behind the IBM PC and similar machines not ...
The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit. Have embedded developers ever had such a ...
At Embedded World, congatec announced its first Arm-based CoM (computer on module) based on NXP Semiconductor’s i.MX95 processor. The conga-SMX95 is the first Arm-based module in congatec’s aReady.CoM ...
The Falcon-544CRS is a 5MP color USB 3.2 camera built on the Onsemi AR0544 HyperLux LP sensor, delivering low-power rolling ...
Computer-on-modules (COMs), or system-on-modules (SOMs), were on full display at embedded world in Nuremberg, June 21–23. COMs, SOMs, or server-on-modules are complete embedded computers on one ...
Developments and trends on the electronics market are generally quickly reflected on the electrical medical equipment market. Cost pressure and time constraints are also heightened here, forcing ...
Previously, LPDDR SDRAM chips were mostly soldered onto the computer's mainboard and therefore could not be replaced later. The LPCAMM2 module standard changes that. Computers equipped with it can be ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
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