Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
KYOTO, Japan--(BUSINESS WIRE)--Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to ...
Sophisticated numerics integrate multiphysics solvers to advance electronic innovations – from 3D integrated circuits (3D-IC) to electric vehicles The Ansys Discovery simulation-driven design tool ...
Ansys Discovery's new high-frequency electromagnetic capabilities encourage companies to shift left – introducing simulation earlier in the design process to a broader set of users Upfront simulation ...
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
Ansys Inc. (Pittsburgh, Pa., U.S.) has announced that simulation product Ansys 2025 R2 features new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility. R2 ...
After a long 18 months of negotiations and regulatory scrutiny, Synopsys has finalized its approximate $35 billion acquisition of Ansys. This acquisition merges two leading companies in their ...
A definitive agreement for Synopsys to acquire Ansys for $35 billion could improve digital twins workflows across different engineering disciplines in chip design, physics, software, and security.
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